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Two-dimensional material film for thermal management of electronic devices
编号：233 访问权限：仅限参会人 更新：2024-04-30 10:34:09 浏览：154次 口头报告

报告开始：暂无开始时间（Asia/Shanghai）

报告时间：暂无持续时间

所在会场：[暂无会议] [暂无会议段]

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摘要
The rapid proliferation of electronic devices has led to a consequential surge in the demand for thermal management products. However, this growth has paralleled a concerning increase in electronic waste (e-waste) generated by these products, posing significant environmental and resource depletion challenges. The conventional thermal management materials, predominantly comprising high-purity metals and mineral materials, pose recycling challenges due to their integration within electronic components.
This research project addresses these challenges by proposing the utilization of two-dimensional materials for interface heat transfer in composite films. Specifically, boron nitride (BN) is explored as a promising two-dimensional material in combination with various solid wastes to develop biodegradable composite films with superior thermal and mechanical properties. One such endeavor involves the preparation of a biodegradable, highly thermally conductive composite film utilizing mango waste, a substantial byproduct of mango processing industries.
Mango waste, comprising peels and kernels, accounts for a significant portion of the fruit's total volume and presents environmental and economic concerns due to its high generation rate and insufficient treatment. By integrating mango waste into composite films alongside two-dimensional materials, we aim to not only repurpose solid waste but also mitigate environmental issues associated with both solid waste and e-waste.
This research endeavors to contribute to the development of sustainable solutions for thermal management in electronic devices while addressing pressing environmental challenges posed by waste accumulation.
 
关键词
Thermal Management
报告人
ZhongYueni
Monash University

稿件作者
ZhongYueni Monash University
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重要日期

  • 会议日期

    05月31日

    2024

    至

    06月03日

    2024

  • 06月03日 2024

    摘要截稿日期

  • 06月03日 2024

    初稿截稿日期

  • 06月03日 2024

    注册截止日期

主办单位
中国力学学会
计算力学专业委员会
颗粒材料计算力学专业组
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河海大学
大连理工大学
中国颗粒学会
江苏省力学学会
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