摘要详情

ID / 提交时间

129 / 2024-08-31 00:49:36

标题

Heat-Electric Field Conversion Model for Measuring Current Density: A Combined Simulation and Experimental Study

关键字

Infrared thermal camera, Current density, Thermal field-electric field coupling, Non-contact measurement

主题及专题

lMeasurement Theory and Methodology

状态

全文录用

作者

XiaoJing / Chengdu Aircraft Industrial (Group) Co., Ltd

RenChao / Chengdu Aircraft Industrial (Group) Co., Ltd.

XuZhichao / Ltd；Chengdu Aircraft Industrial (Group) Co.

ZhuXusheng / Chengdu Aircraft Industrial (Group) Co., Ltd

AoQingyang / Ltd；Chengdu Aircraft Industrial (Group) Co.

ZhangXu / Chengdu Aircraft Industrial (Group) Co., Ltd

摘要

The distribution of current density is crucial for the performance, reliability, and thermal management of electronic devices and conductive materials. Based on heat conduction theory and Joule's law, this paper establishes a model for converting the thermal field to current under AC heat sources and proposes a non-contact method for measuring current density. This method uses an infrared thermal imager to extract temperature distribution and indirectly derive current density, offering high spatial resolution. By separating steady-state periodic variations from transient temperature rises in the distribution, finite element simulations confirmed the proposed coupling between thermal and electric fields, revealing that the amplitude of temperature variations at twice the current frequency is positively correlated with current amplitude and inversely correlated with frequency. The results show that high-resolution temperature distributions obtained via infrared thermography can quantitatively detect current density distribution, aiding in reliability analysis of electronic devices and conductive materials, with significant potential applications in materials science and electrical engineering.