Abstract: With the advancement of the chip industry and manufacturing processes are becoming increasingly sophisticated, the scale and complexity of integrated circuits have significantly increased. This has made wafer manufacturing processes more intricate, leading to a higher probability and variety of wafer defects. To enhance production yield and improve process control, it is crucial to identify defects and address corresponding process issues. This paper presents an improved YOLO-BA wafer detection algorithm based on YOLOv10n. The approach introduces Bottleneck Transformers (BoT) and Adaptive Kernel Convolution (AKConv) into the backbone network, effectively suppressing interference from complex background information while reducing feature redundancy in spatial and channel dimensions. This enables more efficient feature extraction of wafer defects while maintaining model lightweightness. Experimental results show that the improved algorithm achieves a 0.9% higher recall rate, 0.8% higher mAP0.5_0.95, and 0.4% higher mAP0.5 compared to the latest YOLOv10n model, with similar parameter counts and GFLOPs.
Keywords: Wafer, Defect Detection, Deep Learning, YOLOv10, self-attention mechanism