报告详情
Heat-Electric Field Conversion Model for Measuring Current Density: A Combined Simulation and Experimental Study
编号：79
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更新：2024-10-23 10:38:34
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口头报告
报告开始：2024年11月02日 09:50（Asia/Shanghai）
报告时间：20min
所在会场：[P2] Parallel Session 2 [P2-2] Parallel Session 2（November 2 AM）
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摘要
The distribution of current density is crucial for the performance, reliability, and thermal management of electronic devices and conductive materials. Based on heat conduction theory and Joule's law, this paper establishes a model for converting the thermal field to current under AC heat sources and proposes a non-contact method for measuring current density. This method uses an infrared thermal imager to extract temperature distribution and indirectly derive current density, offering high spatial resolution. By separating steady-state periodic variations from transient temperature rises in the distribution, finite element simulations confirmed the proposed coupling between thermal and electric fields, revealing that the amplitude of temperature variations at twice the current frequency is positively correlated with current amplitude and inversely correlated with frequency. The results show that high-resolution temperature distributions obtained via infrared thermography can quantitatively detect current density distribution, aiding in reliability analysis of electronic devices and conductive materials, with significant potential applications in materials science and electrical engineering.
关键词
Infrared thermal camera, Current density, Thermal field-electric field coupling, Non-contact measurement
报告人
RenChao
Dr. Chengdu Aircraft Industrial (Group) Co., Ltd.稿件作者
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重要日期
-
会议日期
10月31日
2024
至11月03日
2024
-
09月30日 2024
初稿截稿日期
-
11月12日 2024
注册截止日期
主办单位
Anhui University
Xi’an Jiaotong University
Harbin Institute of Technology
IEEE Instrumentation & Measurement Society
Xi’an Jiaotong University
Harbin Institute of Technology
IEEE Instrumentation & Measurement Society
联系方式
- Mrs. icsmd
- ic******@163.com
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