Influence of Aggregate Properties on Chip-Seal Adhesion and Interface Bond Strength: Laboratory Testing and Grey-Correlation Analysis
The 20th and 21st joint COTA International Conference of Transportation Professionals
You Zhanping  Michigan Technological University;You Lingyun  ,Huazhong University of Science and Technology
T2
仅限参会人 张贴报告
Critical Stress Analysis in Airfield Jointed Plain Concrete Pavements with Voids underneath Slabs
The 20th and 21st joint COTA International Conference of Transportation Professionals
Zhao Jufei  Key Laboratory of Road and Traffic Engineering of the Ministry of Education, Tongji University
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仅限参会人 张贴报告
Back-Calculation Method of Subgrade Modulus Based on Traffic Speed Deflectometer
The 20th and 21st joint COTA International Conference of Transportation Professionals
zang guoshuai  Jiangsu Sinoroad Engineering Technology Research Institute Co., Ltd
暂无会场信息
仅限参会人 张贴报告
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