Advanced Packaging Technologies for Silicon Carbide Devices and Their Reliability Issues
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Jiang Nan  Hefei Comprehensive National Science Center
T1 /T1 2021年08月25日 17:00~18:00
仅限参会人 课程
Non-smooth characteristics of rotor/stator rubbing systems with the Stribeck friction model
19th Asia-Pacific Vibration Conference
Li Yang   Xi’an Jiaotong University,State Key Laboratory for Strength and Vibration
暂无会场信息
仅限参会人 口头报告
Dynamic Modeling of Rolling Bearing with Local Defect under Thermal Elastohydrodynamic Lubrication
19th Asia-Pacific Vibration Conference
Wang Yubo   Lanzhou University of Technology,School of Mechanical and Electronical Engineering
暂无会场信息
仅限参会人 口头报告
Rest Life Prediction of Rotating Machine Based on Manifold Algorithm and Time-varying Hidden-semi Markov Model
19th Asia-Pacific Vibration Conference
dong zhiyuan  Dalian University of Technology
暂无会场信息
仅限参会人 口头报告
The effect of whole-body vibration on comfort during the cruise of aircraft
19th Asia-Pacific Vibration Conference
Huang Yu  Shanghai Jiao Tong University
暂无会场信息
仅限参会人 口头报告
Sintered-Silver Bonding (SSB) for Power Packaging: Its Science and Practice
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Mei Yunhui  Tianjin Polytechnic University
T1 /T1 2021年08月25日 16:00~17:00
仅限参会人 课程
Multi-MHz Power Conversion Technology Based on GaN Devices
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Yueshi Guan  Harbin Institue of Technology;Wang Yijie  Harbin Institute of Technology;Xu Dianguo  Harbin Institute of Technology
T1 /T1 2021年08月25日 13:30~14:30
仅限参会人 课程
基于多普勒频移的电子器件振动测试
19th Asia-Pacific Vibration Conference
吴 林华  舜宇智能光学技术有限公司
暂无会场信息
仅限参会人 口头报告
移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询