Study on the vertical, lateral, torsional and pitching stiffness and their coupling effects of air spring
19th Asia-Pacific Vibration Conference
Zheng Yiqian South China University of Technology
暂无会场信息
仅限参会人 口头报告
Modeling and Analysis for Dynamic Performances of A Two-layer Engine Front End Accessory Drive System
19th Asia-Pacific Vibration Conference
Sun Yi South China University of Technology
暂无会场信息
仅限参会人 口头报告
Order-frequency spectral correlation decomposition based on RPCA for weak fault feature extraction of rolling bearings under time-varying conditions
19th Asia-Pacific Vibration Conference
Wang Ran Shanghai Maritime University
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仅限参会人 口头报告
Observation of energy band separation of acoustic valley topological edge states
19th Asia-Pacific Vibration Conference
Huang Zhen Xi'an Jiao Tong University
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仅限参会人 口头报告
Frequency band-tunable topological edge state transmission via 2-bit coding acoustic topological metamaterials
19th Asia-Pacific Vibration Conference
Song Xinpei Xi'an Jiaotong University
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仅限参会人 口头报告
Topological Asymmetric Acoustic Transmission Based on Modes Conversion
19th Asia-Pacific Vibration Conference
Chen Chen Xi'an Jiaotong University
暂无会场信息
仅限参会人 口头报告
ITC-Asia 2021 Closing Remark & Best Paper Award
2021 IEEE International Test Conference in Asia
Zhang Ying Tongji University；Li Huawei University of Chinese Academy of Sciences；Zebo Peng Linkoping University；Knoth Rob Cadence；Chang Soon-Jyh National Cheng Kung University
CS /CS
2021年08月20日 22:30~22:45
公开 欢迎辞
Development and applications of packaging materials for power semiconductor devices
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Chen Mingxiang Huazhong University of Science and Technology (HUST)
K /K1
2021年08月26日 11:10~11:50
仅限参会人 特邀报告
Influence of CucorAl wire bonding on reliability of SiC devices
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Chao Fang ,Zhuzhou CRRC Times Semiconductor Co., Ltd.
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公开 张贴报告
