Topological Asymmetric Acoustic Transmission Based on Modes Conversion
19th Asia-Pacific Vibration Conference
Chen Chen Xi'an Jiaotong University
暂无会场信息
仅限参会人 口头报告
ITC-Asia 2021 Closing Remark & Best Paper Award
2021 IEEE International Test Conference in Asia
Zhang Ying Tongji University；Li Huawei University of Chinese Academy of Sciences；Zebo Peng Linkoping University；Knoth Rob Cadence；Chang Soon-Jyh National Cheng Kung University
CS /CS
2021年08月20日 22:30~22:45
公开 欢迎辞
Development and applications of packaging materials for power semiconductor devices
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Chen Mingxiang Huazhong University of Science and Technology (HUST)
K /K1
2021年08月26日 11:10~11:50
仅限参会人 特邀报告
Influence of CucorAl wire bonding on reliability of SiC devices
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Chao Fang ,Zhuzhou CRRC Times Semiconductor Co., Ltd.
暂无会场信息
公开 张贴报告
A 3D coupled-inertial ultra-lightweight elastic metastructure exhibits omnidirectional, wide and low-frequency bandgaps
19th Asia-Pacific Vibration Conference
Ding Wei Xi'an Jiaotong University
暂无会场信息
仅限参会人 口头报告
Analysis of planetary gearbox vibration mechanism based on signal response model
19th Asia-Pacific Vibration Conference
Yang Rui Shandong Jianzhu University
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仅限参会人 口头报告
Low frequency sound insulation of a perforated plate-type acoustic metamaterial
19th Asia-Pacific Vibration Conference
Liu Zhongyuan Qingdao University of Technology
暂无会场信息
仅限参会人 口头报告
Vibration analysis of an acoustic metamaterial plate with periodical multi-degree of freedom resonators attached
19th Asia-Pacific Vibration Conference
Wang Ting Huazhong University of Science and Technology
暂无会场信息
仅限参会人 口头报告
Metamaterials for non-reciprocal wave and vibration control
19th Asia-Pacific Vibration Conference
Zhou Xiaoming Beijing Institute of Technology
暂无会场信息
仅限参会人 口头报告
