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活动简介

The International Symposium on Advances in VLSI Technology (VLSI 2017) is pleased to invite you to respond to our Call for Submissions for SmartTechCon2017, to be held from 17 - 19 August 2017 at the REVA University, Bangalore, India. The usage of technology with daily life has reached a state where human life with semiconductors is intangible. The current cutting-edge technologies in VLSI provide the end-users a marvelous amount of applications, processing power and portability. The Electronics industry has achieved a phenomenal growth over the last few decades, mainly due to the rapid advances in large scale integration technologies and system design applications. With the advent of very large scale integration (VLSI) designs, the number of applications of integrated circuits (ICs) in high-performance computing, controls, telecommunications, image and video processing, and consumer electronics have been rising at a very fast pace. Symposium on Advances in VLSI Technology emphasize on providing a common platform for scientists and researchers to share recent developments.

征稿信息

征稿范围

Research articles are invited for the symposium on following topics but not limited to:

  • Low power devices

  • Modeling and Simulation

  • Multi-domain simulation

  • Device/circuit level variability models;

  • Reliability simulation

  • Logic and Physical synthesis

  • Place & Route, Clock Tree

  • Physical Verification

  • Signal integrity

  • Power analysis and integrity

  • Analog Mixed Signal IP

  • High-Speed interfaces

  • Low-power Analog and RF

  • Memory Design

  • Standard Cell Design

  • Low-power design

  • Thermal estimation and optimization

  • Power estimation methodologies

  • CAD tools

  • MEMS

  • CMOS sensors

  • CAD/EDA methodologies for nanotechnology

  • Nano-electronics and Nano-circuits

  • Nano-sensors, MEMS applications

  • Nano-assemblies and Devices

  • Carbon Nano-tubes based computing

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重要日期
  • 会议日期

    08月17日

    2017

    08月19日

    2017

  • 08月19日 2017

    注册截止日期

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