Threshold voltage control for AlGaN/GaN Fin-HEMTs with combined technologies终稿

Meng Zhang*

全体主题 > Device characterization and modeling

Thermal performance and reliability of high temperature SiC die attachments on direct cooling stacked Si3N4 substrates终稿

Jingru Dai*, Bassem Mouawad, Jianfeng Li, Mark Johnson

全体主题 > Harsh environment (e.g. high temperature) operation and reliability

Novel Silicon Carbide Integrated Power Module for EV application终稿

Bassem Mouawad*, Jordi Espina, Jianfeng Li, Lee Empringham, christopher Johnson

全体主题 > Packaging, power modules, and ICs

A Near Ideal Edge Termination Technique for Ultrahigh-Voltage 4H-SiC Devices with Multi-Zone Gradient Field Limiting Ring终稿

Xiaochuan Deng*

全体主题 > Device structures and fabrication techniques

Reliability investigation of AlGaN/GaN HEMTs under reverse-bias stress at 77K终稿

Qing Zhu, Xiaohua Ma*

全体主题 > Harsh environment (e.g. high temperature) operation and reliability

Comparison of CF4 plasma versus Cl2 plasma dry etching for gate-recessed Normally-off GaN-based MISHEMT终稿

Bin Hou*

全体主题 > Device structures and fabrication techniques

The Thin Plate Heat Pipe Koch Fractal Wick Structures Investigation终稿

Quan Hu, Yunqian Song, Jun Liu, Zhenyu Wang*, Binbin Jiao, Rong Gao

全体主题 > Packaging, power modules, and ICs

Optical Coherence Tomography-Based IGBT Non-Destructive Testing终稿

ZHIYI ZHAO*, Yihua Hu, Yaochun Shen, Chengmin Li, Wuhua Li, Weifeng Hu

全体主题 > Packaging, power modules, and ICs

Influence of the oxygen in Hot-Carrier-Stress-Induced degradation in AlGaN/GaN high electron mobility transistors终稿

Lixiang Chen*

全体主题 > Device characterization and modeling

Non-Magnetic Resonant-Type High-Frequency High-Voltage Power Conversion with Silicon Carbide Power Semiconductor Devices终稿

Chen Yu*, Mao Saijun, Li Chengmin, Li Wuhua, He Xiangning, Jelena Popovic, Jan Ferreira

全体主题 > Harsh environment (e.g. high temperature) operation and reliability

Instability of 4H-SiC Power Device under Repetitive Avalanche Current Stress终稿

全体主题 > Device characterization and modeling

Comparative Packaging Evaluation and Failure Mode Analysis of SiC, Si, and Hybrid Power Modules终稿

全体主题 > Packaging, power modules, and ICs

Simulation Study Of An Injection Enhanced SiC IGBT终稿

Shan Jiang, Xiao-Yan Tang*, Qingwen Song, Yuming ZHANG

全体主题 > Device structures and fabrication techniques

Characterization of SiC MOSFET Switching Performance终稿

全体主题 > Device characterization and modeling

Damping Current Oscillation of SiC JFET Bi-directional Switches during Turn-on Transient终稿

Junyi Yang, Lina Wang*, Xiangcai Zhang, Kabir Oladele Olanrewaju, Haobo Ma

全体主题 > Hard-switched and soft-switched applications