Welcome to the 28th iteration of the IEEE Hot Interconnects symposium. HotI28 will be held August 18-20, 2021.
IEEE Hot Interconnects is the premier international forum for researchers and developers of state of the art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.
Sponsor Type:1
Topics of Interest (but not limited to these):
Novel and innovative interconnect architectures
Multi-core processor interconnects
System-on-Chip Interconnects
Advanced chip-to-chip communication technologies
Optical interconnects Protocol and interfaces for inter-processor communication
Survivability and fault-tolerance of inter-connects
High-speed packet processing engines and network processors
Systems software for communication
System and storage area network architectures and protocols
High-performance host-network interface architectures
High-bandwidth and low-latency I/O
Pb/s switching and routing technologies
Innovative architectures for supporting collective communication
Novel communication architectures to support cloud & grid computing
Centralized and distributed cloud interconnects
Requirements driving high-performance interconnects
Traffic characterization for HPC systems and commercial data centers
Software-defined networking and software overlay networks
Software for network bring-up, configuration and performance management (OpenFlow, OpenSM)
Data Center Networking
08月18日
2021
08月20日
2021
摘要截稿日期
初稿截稿日期
注册截止日期
2025年08月20日 美国
2025 IEEE Symposium on High-Performance Interconnects (HOTI)2022年08月17日 美国
2022 IEEE Symposium on High-Performance Interconnects2017年08月28日 美国 Santa Clara
2017 IEEE第25届高性能互连研讨会2016年08月24日 美国 Santa Clara,USA
2016 IEEE第24届高性能互连研讨会2013年08月21日 美国
2013 IEEE第21届高性能互连研讨会
留言