ICICM is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs. Integrated circuit plays a vital role in electronic information era, which now is becoming a first-class discipline in China. In order to promote the development of ICs, ICICM provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.
The previous 6 editions ICICM have been successfully held in Chengdu on November 23-25, 2016; in Nanjing on November 8-11, 2017; in Shanghai on November 24-26, 2018; in Beijing on October 25-27,2019 and in Nanjing on October 23-25, 2020 and Oct 22-24, 2021. On the basis of success of the previous 6 year, we are proud to announce 2022 The 7th International Conference on Integrated Circuits and Microsystems (ICICM 2022) will be held in Xi'an, China on October 28-31, 2022, which is co-sponsored by Southeast University, China and University of Electronic Science and Technology of China, hosted by Xi'an University of Posts&Telecommunications, China, and technically assisted by by many local and international universities.
Advisory Chairs
Ljiljana Trajkovic, Simon Fraser University, Canada
Conference Chairs
Zhigong Wang, Southeast University, China
Qiang Li, University of Electronic Science and Technology of China, China
Huimin Du, Xi'an University of Posts&Telecommunications, China
Conference Co-Chairs
Letian Huang, University of Electronic Science and Technology of China, China
Xiulong Wu, Anhui University, China
Junyong Deng, Xi'an University of Posts&Telecommunications, China
Program Chairs
Jiliang Zhang, Hunan University, China
Shengbing Zhang, Northwestern Polytechnical University, China
Huiyong Hu, Xidian University, China
Junwei Du, Qingdao University of Science and Technology, China
Shulin Liu, Xi'an University of Science and Technology, China
Ning Xu, Wuhan University of Technology, China
Jun Cheng, Xi'an Jiaotong University, China
Yasuo Watanabe, Institute of Electronics, Information and Communication Engineers (IEICE), Japan
Program Co-Chairs
Abdel-Hamid Ali Soliman, Staffordshire University, UK
Alex Yakovlev, Newcastle University, UK.
Peng Liu, Zhejiang University, China
Zhengfeng Huang, Hefei University of Technology, China
Youyao Liu, Xi'an University of Posts&Telecommunications, China
Ningmei Yu, Xi'an University of Technology, China
Jidong Zhai, Tsinghua University, China
Guojie Luo, Peking University, China
Zhen Hua, Shandong Technology and Business University, China
Xinying Li, Henan University, China
Hui Xu, Anhui University of Science and Technology, China
Zhuo Zou, Fudan University, China
Students Program Chairs
Meng Zhang, Southeast University,China
Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China
Sarawuth Chaimool, Khon Kaen University (KKU), Thailand
Program Committee
Xingyuan Tong, Xi'an University of Posts and Telecommunications, China
Naijin Chen, Anhui Polytechnic University, China
Zhixiong Di, Southwest Jiaotong University, China
Wei Hu, Northwestern Polytechnical University, China
Gang Jin, Xidian University, China
Leilei Liu, Nanjing University of Posts and Telecommunications, China
Fan Ye, Fudan University, China
Jincan Zhang, Henan University of Science and Technology, China
Qifeng Zhao, Zhongyuan University of Technology, China
Publicity Chairs
Jeff Kilby, Auckland University of Technology, New Zealand
Fei Xia, Newcastle University, UK
Wu Gao, Northwestern Polytechnical University, China
Huizhen Qian, University of Electronic Science and Technology of China, China
Nan Chen, Northwestern Polytechnical University, China
Qiang Wu, Southwest Jiaotong University, China
Yuxiang Huan, Guanodong Institute of Inteligence Science and Technology, China
Industry Liaison Chairs
Shuang Song, Facebook
Xia Zhang, Qingdao Qing Ruan Jing Zun Microelectronics Technology Co.,Ltd
Thz and Microwave MicroSystem
Devices and Circuits for Wirless System
Application Specific Circuits and Systems for Communication
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology
(Flash, FeRAM, PCM,ReRAM, MRAM etc.)
10月28日
2022
10月31日
2022
初稿截稿日期
初稿录用通知日期
注册截止日期
2025年10月17日 中国 合肥市(Hefei)
第十届集成电路与微系统国际会议2023年10月22日 中国 Nanjing
2023 8th International Conference on Integrated Circuits and Microsystems2018年11月24日 中国
2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems2017年11月08日 中国 Nanjing
2017 2nd IEEE International Conference on Integrated Circuits and Microsystems2016年11月23日 中国 Chengdu,China
2016年IEEE集成电路与微系统国际会议
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