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活动简介

This conference features interferometry, optical metrology techniques, and related optical techniques enabling non-contact inspection of a wide range of objects from macro- to nano-scale and on surfaces from super-polished to structured or randomly rough. Today, research laboratories, industrial manufacturing, and standardization institutes rely on the precision, reliability and flexibility of these techniques, and new applications are rapidly being developed. Newer technologies utilizing these methods such as MEMS and MOEMS, micro- and nano-scale manufacturing and engineering, as well as biomedical applications push this field into ever challenging new solutions. These new developments have greatly impacted the science of optical measurements and instruments. 

 

Interferometry XVIII combines conferences on Interferometry: Techniques and Analysis and on Interferometry: Advanced Applications so that participants can have access to all the papers. Authors with topics related to interferometry and optical metrology are encouraged to submit to this conference. This conference is expected to receive 80-100 papers covering the latest advances in areas relating to techniques and applications of interferometry and fringe methods. Recent progress and next-generation developments will be highlighted. Invited talks will be included along with regular conference talks and poster presentations. The meeting will encompass 3-4 days and avoid parallel sessions while allowing time for visiting the poster sessions as well as the exhibition. We appreciate your participation, and willingness to present your latest research as we explore a number of current and hot topics. 

征稿信息

征稿范围

Papers are solicited on the following and related topics:

  • active and real-time measurement systems
  • atom interferometry
  • automotive, aerospace and other industrial applications
  • automated measurements
  • bio-interferometry to measure and image cells and tissues
  • biological and pharmaceutical applications
  • calibration and standardization methods
  • digital holography and speckle techniques
  • distance and shape measurements across multiple scales
  • dynamic process characterization
  • flats, sphere, and asphere testing
  • freeform, mid-spatial frequency, and roughness measurement
  • fringe analysis techniques
  • fringe projection and reflection methods
  • grating and grid (moiré) methods
  • gravitational wave interferometry
  • high-speed 3D metrology
  • integrated optical interferometry
  • intelligent metrology systems
  • interaction between modeling, simulation, and experiments
  • interferometric fiber optic sensors
  • materials, structural analysis, and testing
  • MEMS/MOEMS reliability analysis, assembly, and packaging testing
  • nano-metrology
  • nondestructive testing and failure analysis
  • optical projection tomography techniques
  • phase measurement techniques
  • polarization and geometric-phase techniques
  • semiconductor wafer inspection, photolithography mask metrology, and inspection
  • shearing interferometry and other gradient methods
  • stress and strain analysis
  • surface profiling
  • astronomical and adaptive optics through micro optics testing
  • terahertz techniques and applications
  • thin-film metrology
  • tunable wavelength, spectral interferometry and wavelength dependent methods
  • wavefront sensing techniques
  • white light interferometry and optical coherence tomography
  • x-ray and high energy optics characterization
  • to 1/∞ and beyond.
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重要日期
  • 会议日期

    08月28日

    2016

    09月01日

    2016

  • 09月01日 2016

    注册截止日期

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