活动简介

It is our pleasure to welcome you to São Paulo, the venue of the 3rd Global Electromagnetic Compatibility Conference GEMCCON 2017.

After the Australia and Argentina editions, GEMCCON is established as an important forum for discussing Electromagnetic Compatibility.

The GEMCCON 2017 will cover the whole topics of EMC, including the new trends and technologies. Special sessions and exhibition will be organized along with regular sessions.

GEMCCON 2017 is considering the submission of 2-page digests summarizing the theory, methods and results.

The authors of accepted 2-page digests will be invited to present their work at the Conference and submit a full paper of approximately 5000 words with up to 5 pages including diagrams, figures and charts.

All accepted papers, if accompanied by a paid registration, will be included in the conference program and will be available for all attendees on the conference website to be downloaded.

The papers will be presented in a 15-minute oral briefing with charts from a digital projector & computer or in an open forum as poster papers.

征稿信息

重要日期

2017-04-16
摘要截稿日期
2017-04-16
初稿截稿日期
2017-06-18
初稿录用日期
2017-08-18
终稿截稿日期

征稿范围

TC-1 EMC Management

  • Personnel & Laboratory Accreditation

  • EMC Education

  • Legal Issues

TC-2 EMC Measurements

  • Test Instrumentation & Facilities

  • Measurement Techniques

  • Standards and Regulations

TC-3 EM Environment

  • EM Signal Environment

  • Atmospheric & Man-Made Noise

TC-4 EM Interference

  • Shielding, Gasketing & Filtering

  • Cables and Connectors

  • Circuit & System EMC Analysis

  • Grounding

TC-5 High Power Electromagnetics

  • ESD & Transients

  • EMP, IEMI & Lightning

  • Information Leakage

  • Electric Power EMC

TC-6 Spectrum Engineering

  • Spectrum characterization and modeling

  • Design for spectrally efficient systems

  • Adaptive interference mitigation

TC-7  Low Frequency EMC

  • Power Quality and Conducted EMC

  • Power Electronics

TC-9 Computational Electromagnetics

  • Computer Modeling Methods

  • Tools and Techniques

  • Validation Methods

  • Statistical Analysis

TC-10 Signal and Power Integrity

  • High-Speed Interconnects

  • Device Modeling & Characterization

  • Crosstalk, Jitter, Noise Coupling, BER Analysis

  • 3D IC & TSV

  • Power Distribution Networks & Decoupling

  • SI/PI/EMI Co-Design

TC-11 Nanotechnology & Advanced Materials

  • Nanomaterials & Nanostructures

  • Smart Materials

TC-12:  EMC for Emerging Wireless Technologies

  • EMC Planning/Testing/Specifications

  • Wireless Coexistence

  • Intra-System Interference

SC1  Smart Grid EMC

  • RF Environment

  • Performance Degradation

SC5 Power Electronics EMC

  • power electronics converters EMI/EMC issues

  • switching frequency schemes

  • inverters

  • grid-connected PV systems, wind farms, automotive, aerospace, and communication systems.

SC6 Unmanned Aircraft Systems EMC

  • Spectrum Management on Intra and Inter-System Interactions

  • Design, Testing, Modeling/Simulation Required for System Level EMC for Unmanned Aircraft Systems

  • Robust Performance in the Presence of High Intensity Radiated Fields (HIRF)

SC7 Aeronautics and Space EMC

  • EMI/EMC issues in aircraft, spacecraft & space launch vehicles, robotic and crewed

  • EMC analysis, design, test and performance of space systems

  • Part, board, box, system, multi-system, planetary and interplanetary levels

  • Launch and space environments

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重要日期
  • 会议日期

    11月08日

    2017

    11月10日

    2017

  • 04月16日 2017

    摘要截稿日期

  • 04月16日 2017

    初稿截稿日期

  • 06月18日 2017

    初稿录用通知日期

  • 08月18日 2017

    终稿截稿日期

  • 11月10日 2017

    注册截止日期

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