It is our pleasure to welcome you to São Paulo, the venue of the 3rd Global Electromagnetic Compatibility Conference GEMCCON 2017.
After the Australia and Argentina editions, GEMCCON is established as an important forum for discussing Electromagnetic Compatibility.
The GEMCCON 2017 will cover the whole topics of EMC, including the new trends and technologies. Special sessions and exhibition will be organized along with regular sessions.
GEMCCON 2017 is considering the submission of 2-page digests summarizing the theory, methods and results.
The authors of accepted 2-page digests will be invited to present their work at the Conference and submit a full paper of approximately 5000 words with up to 5 pages including diagrams, figures and charts.
All accepted papers, if accompanied by a paid registration, will be included in the conference program and will be available for all attendees on the conference website to be downloaded.
The papers will be presented in a 15-minute oral briefing with charts from a digital projector & computer or in an open forum as poster papers.
TC-1 EMC Management
Personnel & Laboratory Accreditation
EMC Education
Legal Issues
TC-2 EMC Measurements
Test Instrumentation & Facilities
Measurement Techniques
Standards and Regulations
TC-3 EM Environment
EM Signal Environment
Atmospheric & Man-Made Noise
TC-4 EM Interference
Shielding, Gasketing & Filtering
Cables and Connectors
Circuit & System EMC Analysis
Grounding
TC-5 High Power Electromagnetics
ESD & Transients
EMP, IEMI & Lightning
Information Leakage
Electric Power EMC
TC-6 Spectrum Engineering
Spectrum characterization and modeling
Design for spectrally efficient systems
Adaptive interference mitigation
TC-7 Low Frequency EMC
Power Quality and Conducted EMC
Power Electronics
TC-9 Computational Electromagnetics
Computer Modeling Methods
Tools and Techniques
Validation Methods
Statistical Analysis
TC-10 Signal and Power Integrity
High-Speed Interconnects
Device Modeling & Characterization
Crosstalk, Jitter, Noise Coupling, BER Analysis
3D IC & TSV
Power Distribution Networks & Decoupling
SI/PI/EMI Co-Design
TC-11 Nanotechnology & Advanced Materials
Nanomaterials & Nanostructures
Smart Materials
TC-12: EMC for Emerging Wireless Technologies
EMC Planning/Testing/Specifications
Wireless Coexistence
Intra-System Interference
SC1 Smart Grid EMC
RF Environment
Performance Degradation
SC5 Power Electronics EMC
power electronics converters EMI/EMC issues
switching frequency schemes
inverters
grid-connected PV systems, wind farms, automotive, aerospace, and communication systems.
SC6 Unmanned Aircraft Systems EMC
Spectrum Management on Intra and Inter-System Interactions
Design, Testing, Modeling/Simulation Required for System Level EMC for Unmanned Aircraft Systems
Robust Performance in the Presence of High Intensity Radiated Fields (HIRF)
SC7 Aeronautics and Space EMC
EMI/EMC issues in aircraft, spacecraft & space launch vehicles, robotic and crewed
EMC analysis, design, test and performance of space systems
Part, board, box, system, multi-system, planetary and interplanetary levels
Launch and space environments
11月08日
2017
11月10日
2017
摘要截稿日期
初稿截稿日期
初稿录用通知日期
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2015年11月10日 澳大利亚
2015年IEEE国际电磁兼容会议
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