Testing and Fault-Localization Solutions for Monolithic 3D ICs
2021 IEEE International Test Conference in Asia
Chaudhuri Arjun Duke University
SS /SS3
2021年08月20日 20:20~20:40
仅限参会人 口头报告
3D Test Wrapper Design and Physical Optimization
2021 IEEE International Test Conference in Asia
Chickermane Vivek Cadence Design Systems；Mukherjee Subhasish Cadence
SS /SS3
2021年08月20日 20:00~20:20
仅限参会人 口头报告
An optimized DFT technology based on machine learning
2021 IEEE International Test Conference in Asia
Yang Han Nanjing University of Posts and Telecommunications
SS /SS2
2021年08月19日 22:30~22:50
仅限参会人 口头报告
A Low-Cost Quadruple-Node-Upset Self-Recoverable Latch Design
2021 IEEE International Test Conference in Asia
Wen Yan ChangSha university of science and technology
SS /SS1
2021年08月19日 20:00~20:20
仅限参会人 口头报告
Reduction of vibrotactile perception level for vehicle accelerator pedal
19th Asia-Pacific Vibration Conference
Yoo Junsun Yonsei University
暂无会场信息
仅限参会人 口头报告
Integration implementation of parametric design of porous materials and acoustic performance analysis（abstract）
19th Asia-Pacific Vibration Conference
KeXuan Yao southern university of science and technology
暂无会场信息
仅限参会人 口头报告
Volume diagnosis progress / challenges
2021 IEEE International Test Conference in Asia
Guo Ruifeng Synopsys, USA；Cheng Wu-Tung Siemens Digital Industries Software, USA
IS /IS3
2021年08月20日 11:30~11:50
仅限参会人 口头报告
Accuracy and scalability of physically aware diagnosis for yield learning
2021 IEEE International Test Conference in Asia
Cheng Wu-Tung Siemens Digital Industries Software, USA
IS /IS3
2021年08月20日 12:10~12:30
仅限参会人 口头报告
Advancements in Diagnosis and Yield
2021 IEEE International Test Conference in Asia
Chillarige Sameer Cadence
IS /IS3
2021年08月20日 11:50~12:10
仅限参会人 口头报告
Combining structural and functional monitoring for improving overall safety and reliability of automotive ICs
2021 IEEE International Test Conference in Asia
Mukherjee Nilanjan Siemens Digital Industries Software
IS /IS2
2021年08月19日 22:50~23:10
仅限参会人 口头报告
