The 37th Photomask Technology Conference, organized by SPIE and BACUS (the International Photomask Technical Group of SPIE), provides a seminal international forum to present photomask technology advances and their impact on semiconductor lithography. In many ways, masks represent the confluence of the abstractness of designer intent and the physical reality of wafer lithography. Photomasks enable DUV and EUV lithography, while the closely-related master templates enable nanoimprint lithography (NIL). Consequently, SPIE Photomask has become the key venue to present technology advances on mask process, but also on OPC, data preparation, metrology, mask imaging, and mask business. The mask is a good vantage point for viewing lithography. In 2016, Chris Progler (Photronics) talked about the cost of complexity. Scaling will continue, but the added cost of complexity is also of interest to most decision-makers and adds another dimension to possible contributions for the 2017 conference.
We are excited to announce that for 2017, Photomask will be collocated with the EUVL. The combined event will include four days of technical presentations and events.
Suggested topics for Photomask submissions include, but are not limited to:
Computational Lithography
Optical Proximity Correction (OPC)
Source/mask optimization (SMO)
Mask imaging / mask 3D effects
Simulation and modeling-design for manufacturability.
Mask Technology
Mask data preparation (MDP)
Mask process correction (MPC)
Advanced data preparation techniques
Novel jobdeck requirements for new write formats
Substrates and materials
Patterning tools and processes
Resist and resist processing and etch
Metrology, inspection, repair
Cleaning, contamination, and haze
EUV mask technologies
Equipment infrastructure
Blank and resist
Actinic and non-actinic characterization strategies
Pellicles
Multi-patterning, optical and EUV hybrid.
Imaging and Emerging Mask Technologies
Nano imprint mask making and applications
Multi-beam mask writers
Alternative mask technologies
High NA-anamorphic impacts on mask- Grey-scale masks
Direct-write, maskless lithography
Inverse lithography and pixelated mask technology.
Mask Application
Patterned media
Flat panel display
MEMS patterning
Silicon photonics.
Mask Business
Mask manufacturing management
Mask management in wafer fabs
Business aspects of masks
Infrastructure challenges.
Special Sessions
Student only competing for Photronics Award and ZEISS Award.
Panel Discussion.
Masks for alternate lithography applications.
09月11日
2017
09月14日
2017
终稿截稿日期
注册截止日期
2016年09月12日 美国 San Jose,USA
2016年光掩膜技术国际会议
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