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EUV Lithography continues to make progress towards production deployment, however DUV multi-patterning remains the sole advanced lithography solution in use today. We must continue to improve optical mask technology to support the extension of multi-patterning to triple and quadruple patterning into the sub-10nm nodes. There is a strong push for more focus on infrastructure needs for mask manufacturing, particularly for EUV masks including actinic solutions for inspection and metrology, and advanced 2D characterization techniques to support optical lithography solutions. New resists are now being developed concurrently with blanks for optimum performance; EUV blanks are in the critical path.

What changes should mask makers expect that allow the industry to stay on Moore’s Law and the cost roadmap? Is a paradigm shift ahead of us? 

As mask makers we must continue to focus on providing mask solutions for EUV, multiple patterning, complex OPC’ed masks, NIL, SMO, and the other lithography solutions in an environment in which continuously tightening error budgets increase the burden the mask manufacturing infrastructure must bear.

The 36th Photomask Symposium, organized by SPIE and BACUS, the International Photomask Technical Group of SPIE, provides the forum to present these technology advances and their impacts on semiconductor lithography.

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Suggested topics for submissions include, but are not limited to: 

  • Mask Making

  • mask data preparation

  • substrates and materials

  • patterning tools and processes

  • resist and resist processing

  • etch techniques

  • metrology

  • inspection

  • repair

  • cleaning, contamination, and haze

  • mask process correction.

  • EUV Mask Technologies

  • mask making

  • equipment infrastructure

  • blank and resist

  • high NA: anamorphic impacts on mask

  • actinic and non-actinic characterization strategies

  • optical implementation

  • source/mask optimization

  • pellicles

  • multipatterning, optical and EUV hybrid.

  • Emerging Mask Technologies

  • nanoimprint mask making and applications

  • multibeam mask writers

  • alternative mask technologies

  • grey-scale masks

  • direct-write, maskless lithography

  • inverse lithography and pixelated mask technology.

  • Computational Lithography

  • edge placement error

  • source/mask optimization

  • advanced data preparation techniques

  • novel jobdeck requirements for new write formats

  • resolution enhancement techniques and OPC

  • design for manufacturability

  • simulation and modeling.

  • Mask Application

  • patterned media

  • flat panel display

  • MEMS patterning

  • silicon photonics.

  • Mask Business

  • mask manufacturing management

  • mask management in wafer fabs

  • business aspects of masks

  • infrastructure challenges.

  • Special Sessions

  • Student only competing for Photronics Award and ZIESS Award.

  • Panel Discussion.

  • Masks for alternate lithography applications.

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重要日期
  • 会议日期

    09月12日

    2016

    09月14日

    2016

  • 09月14日 2016

    注册截止日期

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